Integrated Sub-Assemblies

ADI applies expertise in system analysis, MMIC, complex ICs, and module design, mechanical packaging, automated manufacturing, RF testing, screening, and qualification. Since the majority of ICs are ADI products, there are significant benefits in controlling performance, scheduling, screening, qualification, packaging, part obsolescence, troubleshooting, and design optimization.

ADI Manufacturing and Test Abilities Include

  • ISO 9001:2008 and AS9100:2009 certified
  • Automatic hybrid assembly equipment; includes
    • Die inspect/pick
    • Die/substrate attach
    • Wire bond
  • IR reflow equipment for PCB-based assemblies
  • Automated digital product test to 40 Gbps
  • Automated RF, microwave, and millimeter wave product tests to 110 GHz

GaN and High Power Amplifiers

ADI’s leading edge GaN power amplifiers provide best-in-class in efficiency and power handling from L to Ka-band. Leading edge MMIC design and packaging simplifies integration and system development for aerospace and defense wide range of applications, with an expanding portfolio of non-ITAR and non-export controlled solutions.

Integrated solutions, utilizing advanced power combining techniques provide high power amplifiers supporting up to 32 kW output power from L band to Ka-band, provides alternative solutions to traditional traveling wave tube devices with increased reliability and efficiency.


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